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Compute Chips
The Post-Moore Path for AI Chips: Advanced Packaging Succeeds Process Scaling
For decades, the semiconductor industry rode a remarkably simple storyline: shrink transistors, pack more of them onto a die, and enjoy automatic gains in performance and efficiency. That story—embodied in Moore’s Law—still matters, but for AI chips in the mid‑2020s it is no longer the sole, or even primary, driver of progress.
Compute Chips
Global AI Accelerator Market Breaks $250B in 2026: A Supply Chain Teardown
By 2026, AI accelerators have moved from niche hardware to the beating heart of modern compute, powering everything from frontier model training to real‑time inference across clouds, enterprises, and edge devices. Crossing the $250 billion mark in annual market value is not just a milestone; it is a reflection of a vast, intricate supply chain that stretches from design labs and fabs to packaging houses, board makers, system integrators, and the services that wrap around them. Understanding how this value is created and captured requires a teardown of the AI accelerator supply chain, layer by layer.
Compute Chips
AI Chip TDP Grows 50% Per Gen, Data Center Power Architecture Faces Reassessment
Over the past several AI chip generations, one trend has become impossible to ignore: thermal design power (TDP) is climbing at a pace that would have seemed extreme even a few years ago. When flagship accelerators and high‑end AI chips see TDP grow on the order of 50% per generation, the consequences extend far beyond chip packaging.
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